Semsysco
Plating, Electroless, Wet clean Processing Equipment
Single Wafer Triton, Batch Spray SAP｜SSP｜SOP
Single Wafer｜Clean｜Etch｜ECD
BATCH PROCESSING PLATFORM
半自動｜蝕刻製程
半自動/全自動｜無電極電鍍（化鍍）
全自動｜化學清洗｜溼蝕刻製程用
BATCH WAFER PLATFORM
- The GLAXY platform combines years of experience in batch wafer processing with the cutting edge of process control typically only found on single wafer tools.
- It can grow with process needs suitable for prototyping as well as for mass production. Solvent, acid or Ozone processing is possible. The modular design allows single chamber semi-manual tools up to multiple chambers fully automated platform – manual cassette loading and change over to guardian carriers for full automation is possible.
- By changing the carrier, different substrate sizes can be processed.
MODULAR DESIGN
The modular approach to the batch tool gives you all the potential configurations that satisfy your processing requirements. From a single chamber manual tool, to a two, four, or even eight chamber fully automated tool, with a mix of solvent or acid processing chambers, the basic tool remains the same, and layers of functionality are added on.
ADDITIONAL FEATURES
An additional feature is the adding on of immersion tanks to allow the electro-less deposition of metals. Our Galaxy-EL features pre-treatment, rinse-dry batch chambers as well as the tanks necessary to deposit metals very thin and very homogeneously, while offering superior bath life, minimal drag out and excellent uniformity.
GALAXY CUSTOMER ADDED VALUES
- Identical chambers for manual and fully automated tools in the modular platform
- Outstanding automation reliability and speed
- Customized to our customer’s needs
- Possibility of processing more than one substrate size per chamber with change of carrier
- Electroless plating can be added optionally to the Galaxy Platform
- Upgrade- and future-proof
- Established high-throughput processing chambers
GALAXY HIGHLIGHTS
- Processing of 3” to 300 mm substrates
- Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
- Industry 4.0 ready – control and monitor all process parameters similar to a single wafer tool
- Etch uniformity 3% or better
- Online dosing system
- Online chemical monitoring
- Online gas detection for safety
- End-point detection for many etch processes
