Unity SC
Film Metrology
Non contact warpage measurement
Axiospect 300, 301, 302
Automated Microscope
．Inspection, Review Metrology
．Generation microscope based on Carl Zeiss technology
．Full-auto-modus
．ADR Defect Review vs. Golden Image ROI review (KLARF, recipe)
．Darkfield/Brightfield
Front side: 150x UV 0.1µm
Back side: 50x 0.5µm
Auto.-Edge: Optical (50µm) @ 50 wph and IR (2µm)
．HSEB IP TCI Technology
．LED or HXP illumination
．UV: 365nm/248nm
IR: 1.1µm (Si)
．EBR Metrology
．CD/OVL, thickness
．CSM, DIC
．HSEB IP macro station / DEDO
Odin
High Resolution
．Die-based reference (die and Multi chip)
．Front side:
BF, 2.5µm pixel size
Up to 80 WPH @300mm Up to 120 WPH @200mm
．Back side:
BF, 2.5µm pixel size
W/ Wafer Flip handling system
．Bevel:
5µm
30mm up to 150 WPH
．HSEB IP TCI Technology/100% OTF
．Review Microscope: BF/DF, 100x (Max)
．Metrology: CD/OVL、3D Metrology
Wotan
Fast Macro- Inspection
．Wafer-based self-referencing
．Front side:
20µm @300mm >150 WPH
10µm @200mm or below >120 WPH
．Back side:
Simultaneously BS scan along with FS,
No impact on WPH
．Bevel:
5µm
30mm up to 150 WPH
．HSEB IP TCI Technology/100% OTF
．Review microscope ( Optional ): Separate microscope module BF/DF, 100x (Max)
．Metrology: (Optional)CD/OVL
Thor
Edge Inspection
．5-Zone Edge Inspection
．Defect Inspection：5µm @ 150wph for 5 Zones
．HSEB IP TCI Technology/100% OTF
．Metrology: Multiple EBR/WEE metrology
．Stand-alone Integrated into AOI products
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